- copper eutectic solder
- copper eutectic solder eutektisches Kupferlot n
English-German dictionary of Electrical Engineering and Electronics. 2013.
English-German dictionary of Electrical Engineering and Electronics. 2013.
Solder — A solder is a fusible metal alloy with a melting point or melting range of 90 to 450 °C (200 to 840 °F), used in a process called soldering where it is melted to join metallic surfaces. It is especially useful in electronics and plumbing. Alloys… … Wikipedia
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… … Wikipedia
Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… … Wikipedia
Restriction of Hazardous Substances Directive — European Union directive: Directive 2002/95/EC Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment Made by Council Parliament … Wikipedia
Brazing — This article is about the metal joining process. For the cooking technique, see braising. Brazing practice Brazing is a metal joining process whereby a filler metal is heated above and distributed between two or more close fitting parts by… … Wikipedia
Gold plating — is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical means.Mechanical or chemical affixing of thin gold foils onto the surface of objects is instead known as … Wikipedia
Power electronic substrate — The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components. Compared to materials and techniques used in lower power microelectronics,… … Wikipedia
tin processing — Introduction preparation of the ore for use in various products. Tin (Sn) is a relatively soft and ductile metal with a silvery white colour. It has a density of 7.29 grams per cubic centimetre, a low melting point of 231.88° C… … Universalium
Tin — is a chemical element with the symbol Sn ( la. stannum) and atomic number 50. This silvery, malleable poor metal that is not easily oxidized in air and resists corrosion, is found in many alloys and is used to coat other metals to prevent… … Wikipedia
Homologous temperature — expresses the temperature of a material as a fraction of its melting point temperature using the Kelvin scale. For example, the homologous temperature of lead at room temperature is approximately .50 (TH = T/Tmp = 298K/601K = .50).Solder (m.pt… … Wikipedia